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Overview IEC 60749-22-1:2025 is a critical international standard from the International Electrotechnical Commission (IEC) detailing mechanical and climatic test methods for semiconductor devices, sp…
Overview - IEC 60749-22-2:2025 (Wire Bond Shear Test Methods) IEC 60749-22-2:2025 specifies standardized wire bond shear test methods to determine the strength of a ball bond to a die or package bond…
Overview IEC 60749-2:2002 is an international standard published by the International Electrotechnical Commission (IEC) that defines the mechanical and climatic test methods focused on low air pressu…
Overview IEC 60749-22:2002 is an international standard established by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor device…
1 Scope This part of IEC 60749 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devi…
1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be…