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Overview - IEC 60749-22-2:2025 (Wire Bond Shear Test Methods) IEC 60749-22-2:2025 specifies standardized wire bond shear test methods to determine the strength of a ball bond to a die or package bond…
Overview IEC 60749-22:2002 is an international standard established by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor device…
1 Scope This part of IEC 60749 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devi…