Найдено: 7
Overview IEC 61188-5-2:2003 is an international standard published by the International Electrotechnical Commission (IEC) that provides comprehensive guidance on the design and use of land patterns f…
Overview IEC 61188-5-6:2003 is an international standard published by the International Electrotechnical Commission (IEC) focusing on printed boards and printed board assemblies-specifically the desi…
Overview IEC 61188-5-8:2007 - Printed board and printed board assemblies: Attachment (land/joint) considerations - provides guidance on land pattern geometries for area array components including BGA…
Overview IEC 61188-5-4:2007 is an IEC standard that defines component and land‑pattern dimensions for small outline integrated circuits with two‑sided J leads (SOJ) intended for the reflow soldering…
Overview IEC 61188-5-5:2007 is an international standard for PCB designers and electronics assemblers that defines land pattern geometries for components with gull‑wing leads on four sides (quad pack…
Overview IEC 61188-5-3:2007 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the design and use of land pattern geometries for electronic c…