SIST EN ISO 9455-10:2013 PDF

Name: SIST EN ISO 9455-10:2013 — Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
SKU: SIST EN ISO 9455-10:2013
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Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)

Название (английский):

SIST EN ISO 9455-10:2013

Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 16
Дата публикации:: 2 апреля 2013 г.
ICS:: 25.160.50
Технический комитет:: VAR - Welding

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Описание (английский):

This part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler metal and is applicable to all flux classes defined in ISO 9454-1. NOTE An alternative method for the determination of the flux efficacy, applicable to liquid fluxes only, known as the wetting balance method, is specified in ISO 9455-16.[3]

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

EN ISO 9455-10:2012 - "Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method" specifies a laboratory test to determine the efficacy of soft soldering fluxes. Known as the solder spread method, the test measures how well a flux promotes the spreading (wetting) of a molten filler metal on a prepared metal surface. The method is applicable to all flux classes defined in ISO 9454-1 and is standardized by CEN/ISO for consistent, repeatable results.

Key topics and requirements

Scope and principle

Measures flux performance by applying a fixed quantity of flux and a standard solder sample to a prepared brass test plate, immersing briefly in a solder bath, then measuring the spread area of the solidified solder.

Test specimens

Brass test plates (40 × 40 mm, CuZn37 or CuZn40, 0.5 mm thick) are specified; oxidized copper plates are allowed as an alternative.
Solder wire straightened and cleaned, wound into a flat spiral; specific solder alloys and temperatures are listed (e.g., Sn60Pb40 at 235 °C ±3 °C, Sn96Ag3Cu1 at 255 °C ±3 °C).

Apparatus and reagents

Requirements include a solder bath (depth and temperature control), microsyringe/micropipette (25 µL), planimeter for area measurement, micrometer for height measurement, and cleaning/acid solutions.

Procedure

Detailed cleaning and surface preparation of plates (degrease, acid preparation solution cycles, rinsing).
Application of measured flux (0.025 mL for liquids or 0.025 g for pastes/solids) and standard solder; immerse for a controlled time (spread measured after ~5 s of spreading and cooling).

Result expression and precision

Spread area measured (planimeter) or height measured (micrometer) and expressed as a spread ratio/percentage. The standard includes precision guidance and options for comparison with a reference flux.

Applications and users

Who uses this standard

Flux manufacturers and R&D teams evaluating product performance.
Third‑party test laboratories performing quality control and acceptance testing.
Soldering process engineers and quality assurance (QA) personnel in electronics manufacturing, HVAC/plumbing, and other industries that use soft soldering.
Spec writers and procurement teams requiring an objective flux efficacy metric.

Practical value

Provides a repeatable, comparative measure of a flux’s wetting ability on brass/copper substrates - useful for product development, batch acceptance, and troubleshooting solderability issues.

Related standards

ISO 9454-1 - Classification and requirements for soft soldering fluxes (flux classes referenced by this test).

ISO 9455-16 - Alternative efficacy test for liquid fluxes using the wetting balance method.

ISO 9453 - Chemical compositions and forms of soft solder alloys used in testing.

Keywords: EN ISO 9455-10:2012, soft soldering fluxes, flux efficacy test, solder spread method, brass test plates, solderability testing, wetting balance method, ISO 9454-1.

SIST EN ISO 9455-10:2013 PDF

Abstract

Похожие стандарты

Overview

Key topics and requirements

Applications and users

Related standards

Технические детали

ISO 9455-10:2012

Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method

SIST EN ISO 9454-1:2016

Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (IS…

SIST EN ISO 9455-16:2020

Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2019)

SIST EN ISO 9453:2020

Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)