IEC 60748-23-3:2002
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 78
- Дата публикации:
- 17 мая 2002 г.
- Издание:
- IEC IS 60748 edition 1 version 1
- ICS:
- 31.200
Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate with ongoing information on process control demonstrating compliance with IEC 60748-23-1.
Abstract
Overview
IEC 60748-23-3:2002 is an International Electrotechnical Commission (IEC) standard that defines a manufacturers' self-audit checklist and report for manufacturing line certification of hybrid integrated circuits and film structures. It supports a high quality approval system and is intended for use by a hybrid microcircuit manufacturer's internal assessment team and by National Supervising Inspectorates (NSI) to demonstrate ongoing process control and compliance with IEC 60748-23-1. The checklist is submitted during application or as evidence of continuing compliance (at intervals not exceeding one year).
Key Topics and Requirements
This part focuses on practical, process-level controls rather than broader quality management systems. Major technical topics covered include:
- Self-audit checklist and reporting structure for thick and thin film hybrid manufacturers
- Approval information and description of company/report structure
- Summary of testing and analytical methods; supporting evidence (SPC, engineering reports) should be appended
- Control of procurement sources and incoming materials
- Environmental control and electrostatic handling (ESD protection)
- Change notification requirements and hybrid design controls
- Detailed process-area sections:
- Thick film processing (artwork, substrates, pastes, drying/firing, trimming, inspection, rework)
- Thin film processing (masks, deposition, patterning, stabilization, trimming, rework)
- Hybrid assembly (soldering, chip and wire assembly, termination robustness)
- Test and dispatch procedures (electrical tests, burn‑in, environmental tests such as damp heat, vibration, shock, sealing/leak tests, visual/radiographic inspection)
- Certain checklist items are shown as mandatory in the document and must be addressed affirmatively or clearly marked “not applicable.”
Applications and Who Should Use It
IEC 60748-23-3 is intended for:
- Hybrid integrated circuit manufacturers performing internal process audits
- Quality engineers and process control teams establishing evidence of manufacturing line certification
- NSIs and certifying bodies reviewing submissions for IEC 60748-23-1 approval
- Procurement and design engineers who need to verify supplier capability for hybrid microcircuits and film structures
Practical uses include line certification submissions, annual self-assessments, supplier qualification, and documenting in‑process controls (e.g., SPC data, engineering reports) to support product reliability claims.
Related Standards
- IEC 60748-23-1 (Generic manufacturing line certification)
- IEC 60748-23-2 (Internal visual inspection and special tests)
- IEC 60748-23-4 (Blank detail specification)
- IEC 60748-1, IEC 60068-2-20, IEC 60695-2-2, IEC 61340-5-1 (referenced normative documents)
- IECQ 001002-3 (IECQ approval procedures)
Keywords: IEC 60748-23-3, hybrid integrated circuits, manufacturing line certification, manufacturers' self-audit, checklist and report, hybrid microcircuit, film structures, process control, NSI, SPC.
Технические детали
- Технический комитет
- SC 47A - Integrated circuits
- SKU
- IEC 60748-23-3:2002
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