IEC 60749-28:2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 44
- Дата публикации:
- 28 марта 2017 г.
- Издание:
- IEC IS 60749 edition 1 version 1
- ICS:
- 31.080.01
IEC 60749-28:2017(E) establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex I. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.
Abstract
Overview
IEC 60749-28:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level" defines a standardized procedure for testing, evaluating and classifying the susceptibility of semiconductor devices to Charged Device Model (CDM) electrostatic discharge. The document specifies a reproducible, field‑induced (FI) CDM method at device level (with a direct contact DC method described in Annex I), and applies to packaged semiconductor devices, thin‑film circuits, SAW and opto‑electronic devices, hybrid ICs and multi‑chip modules.
Key topics and requirements
- Scope of applicability: All packaged semiconductor devices, thin film circuits, SAW devices, opto‑electronic devices, HICs and MCMs assembled into final‑like packages. The CDM procedure does not apply to socketed discharge model testers.
- Test methods: Primary field‑induced (FI) CDM method; alternative direct contact (DC) CDM method described in Annex I.
- Required equipment: CDM ESD tester components including current‑sensing element, ground plane, field plate and dielectric, charging resistor; high‑bandwidth waveform measurement instruments; verification modules (metal discs); capacitance meter and ohmmeter.
- Waveform verification & tester qualification: Procedures for periodic qualification/requalification, waveform capture, quarterly and routine verification to ensure inter‑tester repeatability. Includes guidance for oscilloscope setup and correlation between 1 GHz and higher‑bandwidth measurements.
- Test execution and reporting: Device handling, test temperature and humidity considerations, discharge procedures (single/dual), recording/reporting guidelines and waveform characteristics.
- Classification: Criteria for classifying CDM ESD sensitivity levels to enable consistent comparisons across devices and test setups.
Applications and who uses it
IEC 60749-28 is used by:
- Semiconductor design and test engineers performing CDM ESD qualification.
- Reliability and quality assurance teams defining ESD sensitivity limits.
- Test laboratories and manufacturers implementing CDM test programs.
- ESD program managers and compliance auditors ensuring repeatable, cross‑tester CDM data.
Practical applications include device qualification for manufacturing release, failure analysis of ESD‑related damage, supplier audits, and establishing device handling/board‑level protection strategies based on CDM sensitivity classifications.
Related standards
- IEC 60749-28 is part of the IEC 60749 family covering mechanical and climatic test methods for semiconductor devices.
- Annex I offers the direct contact (DC) CDM alternative; other ESD and semiconductor test standards are typically referenced for broader ESD program alignment (consult national and industry ESD guidance for integration).
Keywords: IEC 60749-28, CDM, Charged Device Model, ESD sensitivity testing, field-induced CDM, semiconductor device testing, waveform verification, tester qualification.
Технические детали
- Технический комитет
- TC 47 - Semiconductor devices
- SKU
- IEC 60749-28:2017
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