IEC 62878-2-603:2025

Name: IEC 62878-2-603:2025 — Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
SKU: IEC 62878-2-603:2025
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Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Название (английский):

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 25
Дата публикации:: 25 февраля 2025 г.
Издание:: IEC IS 62878 edition 1 version 1
ICS:: 31.180

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Описание (английский):

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

IEC 62878-2-603:2025 is an international standard developed by the International Electrotechnical Commission (IEC) that addresses device embedding assembly technology-specifically focusing on stacked electronic modules and the method of testing intra-module electrical connectivity. This standard is crucial for manufacturers and engineers involved in the production and quality assurance of advanced electronic assemblies, particularly when employing modular stacking techniques to achieve higher component density and miniaturization in products such as servers, network systems, IoT devices, and smartphones.

This part of the IEC 62878 standard specifies an electrical test method to identify electrical connectivity defects within stacked electronic modules (SDEMs), particularly those defects caused during the stacking assembly process. The test method leverages bidirectional serial communication bus interfaces (such as I2C, SPI, or JTAG) between modules that have already been verified as "known good modules" (KGM), ensuring high-quality and reliable modular assemblies.

Key Topics

Definition and Importance of Stacked Electronic Modules (SDEM)

SDEMs are created by stacking multiple stackable electronic modules (SAEMs), which integrate various functional elements for improved miniaturization and density.
Each SAEM must be verified as a KGM to meet quality, reliability, and performance requirements.

Test Methodology for Intra-Module Connectivity

The standard outlines procedures for detecting electrical connectivity defects inside a stacked module, focusing on connections that may be impacted by the stacking process.
Utilizes bidirectional serial communication (e.g., I2C bus) to access and evaluate the status of embedded components within the module.

Test Process and Equipment

Emphasizes the importance of preliminary visual inspections and open/short circuit testing before electrical connectivity testing.
Describes the setup involving a test specimen (the SDEM), baseboard, controller with test software, and a converter for interfacing with standard communication protocols.
Continuous testing (e.g., I2C access tests) is performed on all target components to verify successful connection and proper functioning.

Scope and Terminology

Applies specifically to the electrical evaluation of intra-module connectivity after stack assembly.
Clarifies distinction between intra-module (within a module) and inter-module (between modules) connections, focusing on the internal routes that are difficult to inspect physically.

Applications

Electronics Manufacturing and Testing

Essential for OEMs and EMS providers producing stacked or embedded electronic assemblies used in high-performance computing, data centers, and mobile devices.
Facilitates the detection of defects at an early stage, reducing product returns, and ensuring long-term reliability in mission-critical applications.

Module Design and Quality Assurance

Beneficial for design engineers developing higher-density modules where conventional testing methods are inadequate.
Supports more reliable failure analysis and diagnostic processes by providing clear test methods for otherwise inaccessible module connections.

Standardized Communication Bus Protocols

The approach supports a range of serial communication buses commonly used in the electronics industry (I2C, SPI, JTAG), aiding compatibility and integration into existing test environments.

Related Standards

IEC 62878 Series

IEC 62878-2-602:2021 - Evaluation method of inter-module electrical connectivity, providing complementary guidance for inter-module testing.

Supporting Documents

IEC 60194-2 - Vocabulary and common usage in electronic technologies and assembly.
IEEE 1149.1 - Boundary-Scan architecture for test access (JTAG).

By implementing IEC 62878-2-603:2025, organizations ensure robust procedures for intra-module electrical connectivity testing, ultimately contributing to the quality, reliability, and innovation of advanced stacked electronic assemblies in emerging electronic systems.

IEC 62878-2-603:2025

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Технические детали

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation metho…

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologie…