Найдено: 5
Overview IEC 60191-6:2009 is an international standard published by the International Electrotechnical Commission (IEC) that provides general rules for preparing outline drawings of surface-mounted s…
IEC 60191-6-21:2010 Overview IEC 60191-6-21:2010 is an international standard issued by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor…
Overview IEC 60191-6-22:2012, titled Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device pac…
Overview IEC 60191-6-20:2010 is an international standard that provides mechanical standardization rules for semiconductor devices, specifically focusing on the measurement methods for package dimens…
Overview IEC 60191-6-2:2001 - Mechanical standardization of semiconductor devices, Part 6-2 - is an international design guide for preparing outline drawings of surface-mounted semiconductor device p…