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Overview IEC 61188-5-2:2003 is an international standard published by the International Electrotechnical Commission (IEC) that provides comprehensive guidance on the design and use of land patterns f…
Overview IEC 61188-6-3:2024 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies requirements for the design of land patterns and lands on circ…
Overview IEC 61188-5-6:2003 is an international standard published by the International Electrotechnical Commission (IEC) focusing on printed boards and printed board assemblies-specifically the desi…
Overview IEC 61188-6-1:2021 is an international standard published by the International Electrotechnical Commission (IEC) that provides the generic requirements for land pattern design on circuit boa…
Overview - IEC 61188-7:2017 (Electronic component zero orientation for CAD library construction) IEC 61188-7:2017 is an international standard that defines a consistent technique for describing elect…
Overview IEC 61188-6-4:2019 is an international standard developed by the International Electrotechnical Commission (IEC) that sets out the generic requirements for dimensional drawings of surface mo…
Overview IEC 61188-6-2:2021 establishes essential requirements for the design and use of land patterns for surface mounting components (SMD) on circuit boards. Developed by the International Electrot…
Overview IEC 61188-5-8:2007 - Printed board and printed board assemblies: Attachment (land/joint) considerations - provides guidance on land pattern geometries for area array components including BGA…
Overview IEC 61188-5-4:2007 is an IEC standard that defines component and land‑pattern dimensions for small outline integrated circuits with two‑sided J leads (SOJ) intended for the reflow soldering…
Overview IEC 61188-5-5:2007 is an international standard for PCB designers and electronics assemblers that defines land pattern geometries for components with gull‑wing leads on four sides (quad pack…
Overview IEC 61188-5-3:2007 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the design and use of land pattern geometries for electronic c…
What is BS EN IEC 61188 ‑ 6 ‑ 1 - Circuit boards about? BS EN IEC 61188 ‑ 6 ‑ 1 is the sixth part of the European standard on circuit boards and circuit board assemblies in multi-series. BS EN IEC 61…
What is BS EN IEC 61188-6-4 - Surface mounted components (SMDs) about ? BS EN IEC 61188 ‑ 6 ‑ 4 is an international standard used for printed boards and printed board assemblies that specifies the di…
What is BS EN IEC 61188 ‑ 6 ‑ 2 about? BS EN IEC 61188 ‑ 6 ‑ 2 describes the requirements of design and use for soldering surfaces of land patterns on circuit boards. This document includes a land pa…