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Overview EN IEC 61249-3-6:2026 specifies requirements for polytetrafluoroethylene (PTFE) filled, unreinforced laminate sheets-both copper-clad and unclad-intended for use in printed circuit boards (P…
Overview IEC 61249-4-1:2008 specifies requirements for epoxide woven E-glass prepreg of defined flammability used mainly as bonding sheets for the manufacture of multilayer printed boards. The prepre…
Overview IEC 61249-4-2:2005 defines requirements for multifunctional epoxide woven E-glass prepreg of defined flammability used mainly as bonding sheets in multilayer printed circuit board (PCB) manu…
Overview IEC 61249-2-27:2012 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for materials used in printed boards and other i…
Overview IEC 61249-2-43:2016 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for non-halogenated epoxide cellulose paper…
Overview IEC 61249-2-2:2005 is an international standard developed by the International Electrotechnical Commission (IEC). It specifies the requirements for phenolic cellulose paper-reinforced lamina…
Overview IEC 61249-2-23:2005 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed bo…
Overview IEC 61249-4-15:2009 is an international sectional specification for unclad prepreg materials used as bonding sheets in the manufacture of multilayer printed boards. The standard covers a mul…
Overview IEC 61249-2-33:2009 is an international standard published by the International Electrotechnical Commission (IEC) that defines the specifications for materials used in printed boards and int…
Overview IEC 61249-2-22:2005 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed ci…
Overview IEC 61249-2-34:2009 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for materials used in printed boards and oth…
Overview IEC 61249-3-5:1999 specifies requirements for transfer adhesive films used in the fabrication of flexible multilayer printed boards and flex-rigid printed boards. It defines acceptable mater…
Overview IEC 61249-3-3:1999 defines requirements for adhesive coated flexible polyester film (PETP) used in the manufacture of flexible printed wiring and flexible printed boards. It covers one-sided…
Overview IEC 61249-4-19:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for high-performance, non-halogenated epoxid…
Overview IEC 61249-2-4:2001 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for polyester non-woven/woven fibreglass lami…
Overview IEC 61249-2-37:2008 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies the requirements for modified non-halogenated epoxide woven E…
Overview IEC 61249-2-6:2003 specifies the requirements for reinforced base materials used in the manufacture of printed boards and other interconnecting structures. This part of the IEC 61249 series…
Overview The IEC 61249-2-38:2008 standard specifies the requirements for non-halogenated epoxide woven E-glass laminate sheets used as reinforced base materials in printed boards and other interconne…
Overview IEC 61249-2-47:2018 is an international standard that specifies material and performance requirements for non‑halogenated epoxide non‑woven/woven E‑glass reinforced laminate sheets, copper‑c…
Overview IEC 61249-2-1:2005 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies requirements for phenolic cellulose paper reinforced copper-cl…
Overview IEC 61249-2-44:2016 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for non-halogenated epoxide reinforced lamin…
Overview IEC 61249-2-8:2003 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for reinforced base materials used in printed…
Overview IEC 61249-2-52:2025 specifies requirements for thermosetting hydrocarbon resin system, woven E‑glass reinforced laminate sheets with defined flammability (vertical burning test), copper‑clad…
Overview IEC 61249-2-21:2003 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies the requirements for non-halogenated epoxide woven E-glass re…
Overview IEC 61249-4-5:2005 is an international sectional specification for polyimide, modified or unmodified, woven E‑glass prepreg of defined flammability used as unclad bonding sheets in multilaye…
Overview IEC 61249-2-11:2003 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for reinforced base materials used in printe…
Overview IEC 61249-2-41:2010 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on materials for printed boards and other interconnecting structure…
Overview IEC 61249-4-17:2009 sets out the requirements and properties for non-halogenated epoxide woven E-glass prepreg materials used primarily as bonding sheets in the manufacture of multilayer pri…
Overview IEC 61249-4-16:2009 specifies requirements for unclad prepreg materials used as bonding sheets in the manufacture of rigid multilayer printed boards (PCBs), specifically targeting materials…
Overview IEC 61249-2-51:2023 is an important international standard published by the International Electrotechnical Commission (IEC) that specifies the construction, material properties, quality assu…
Overview The IEC 61249-2-9:2003 standard establishes comprehensive requirements for materials used in printed circuit boards (PCBs) and other interconnecting structures. Specifically, it addresses re…
Overview IEC 61249-2-12:1999 defines requirements for epoxide non-woven aramid copper-clad laminate used in printed boards and other interconnecting structures. The standard covers clad materials in…
Overview The IEC 61249-6-3:2023 standard is an international specification developed by the International Electrotechnical Commission (IEC). It focuses on finished fabrics woven from "E" glass electr…
Overview IEC 61249-3-6:2026 is an international standard developed by the International Electrotechnical Commission (IEC) for materials used in circuit boards and other interconnecting structures. Th…
Overview IEC 61249-2-53:2025 defines requirements for PTFE unfilled reinforced laminate sheets, copper-clad, intended for printed boards and other interconnecting structures. The standard covers copp…
Overview IEC 61249-2-45:2018 specifies requirements for non‑halogenated epoxide non‑woven/woven E‑glass reinforced laminate sheets that are copper‑clad for lead‑free assembly. The standard covers cla…
Overview IEC 61249-2-39:2012 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for reinforced base materials used in printe…
Overview IEC 61249-4-12:2005 specifies the requirements for non-halogenated multifunctional epoxide woven E-glass prepreg materials of defined flammability, primarily intended as bonding sheets in co…
Overview IEC 61249-2-46:2018 specifies requirements for non-halogenated epoxide non‑woven/woven E‑glass reinforced laminate sheets used in printed boards and other interconnecting structures. The sta…
Overview IEC 61249-2-40:2012 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for high-performance, non-halogenated epoxide wo…
Overview IEC 61249-2-32:2009 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the technical requirements for reinforced base materials used…
Overview IEC 61249-2-5:2003 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for brominated epoxide cellulose paper reinfo…
Overview IEC 61249-2-10:2003 is an international standard published by the International Electrotechnical Commission (IEC) that defines the material requirements for reinforced base materials used in…
Overview IEC 61249-2-30:2012 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed bo…
Overview IEC 61249-2-13:1999 specifies requirements for cyanate ester non-woven aramid copper-clad laminate used as base material for printed circuit boards and other interconnecting structures. The…
Overview IEC 61249-4-11:2005 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on materials for printed boards and other interconnecting structure…
Overview IEC 61249-2-42:2010 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed bo…
Overview IEC 61249-4-18:2013 is an international standard specifying high-performance epoxide woven E-glass prepreg materials for use in the manufacture of multilayer printed circuit boards (PCBs). T…
Overview IEC 61249-2-36:2008 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for reinforced base materials used in printe…
Overview IEC 61249-2-35:2008 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed bo…
Overview IEC 61249-2-31:2009 is an international standard published by the International Electrotechnical Commission (IEC) that defines the specifications for reinforced base materials used in printe…
Overview IEC 61249-2-7:2002 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies the requirements for epoxide woven E-glass laminated sheets. T…
Overview IEC 61249-3-4:1999 is an international sectional specification from IEC for adhesive coated flexible polyimide film used in flexible printed boards and other interconnecting structures. It d…
Overview IEC 61249-4-14:2009 is an IEC sectional specification for epoxide woven E‑glass prepreg used as unclad bonding sheets in the manufacture of multilayer printed circuit boards (PCBs). The stan…
Overview IEC 61249-2-26:2005 specifies international requirements for non-halogenated epoxide reinforced base materials used in printed circuit boards (PCBs) and other interconnecting structures. Thi…
Overview IEC 61249-8-8:1997 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for temporary polymer coatings, also known as…