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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear the…

Overview IEC 62047-11:2013 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a precise test method for measuring the coefficients of linear…

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin fil…

Overview IEC 62047-12:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a bending fatigue testing method for thin film materials using…

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Overview IEC 62047-1:2016 is an international standard published by the International Electrotechnical Commission (IEC) that sets forth essential terms and definitions for micro-electromechanical dev…

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stre…

Overview IEC 62047-16:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies standardized test methods to determine residual stresses in mic…

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical…

Overview IEC 62047-17:2015 is an international standard published by the International Electrotechnical Commission (IEC) specifically addressing semiconductor devices and micro-electromechanical syst…

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Overview IEC 62047-18:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies bend testing methods for thin film materials used in micro-elec…

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of me…

Overview IEC 62047-13:2012 is an international standard published by the International Electrotechnical Commission (IEC) that defines standardized test methods for measuring the adhesive strength of…

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS mat…

Overview IEC 62047-10:2011 is an international standard developed by the International Electrotechnical Commission (IEC) that defines a micro-pillar compression test method specifically designed for…

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PD…

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic…

Overview IEC 62047-14:2012 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices-specifically micro-electromechanical systems…

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

Overview IEC 62047-19:2013 is an international standard developed by the International Electrotechnical Commission (IEC) that defines the terminology, essential ratings and characteristics, and measu…