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Overview IEC 63011-1:2018 is an international standard from the International Electrotechnical Commission (IEC) that establishes standardized terminology for three-dimensional integrated circuits (3D…
Overview IEC 63011-3:2018 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a reference model and measurement conditions for the through-sil…
Overview IEC 63011-2:2018 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the alignment of stacked dies in three-dimensional (3D) integrat…
What is BS IEC 63011-1 about? BS IEC 63011-1 is the first part of the BS IEC 63011 series of standards that provides definitions pertaining to multichip integrated circuits, as vertically stacked die…
What is BS IEC 63011-2 about? BS IEC 63011-2 is the second part of the BS IEC 63011 series of standards that provides specifications of initial alignment and alignment maintenance between multiple st…
What is BS IEC 63011-3 about? BS IEC 63011-3 is the third part of the BS IEC 63011 series of standards that specifies a reference model of through-silicon via (TSV) electrical characteristics require…