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Overview IEC 60191-6-16:2007 is an international standard published by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor devices, specific…
Overview IEC 60191-6-17:2011 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the mechanical standardization of semiconductor devices, spec…
Overview IEC 60191-6:2009 is an international standard published by the International Electrotechnical Commission (IEC) that provides general rules for preparing outline drawings of surface-mounted s…
Overview IEC 60191-6-13:2016 is an international standard developed by the International Electrotechnical Commission (IEC) for the mechanical standardization of semiconductor device sockets. Specific…
Overview IEC 60191-6-18:2010 outlines the mechanical standardization of semiconductor device packages, focusing specifically on surface mounted ball grid array (BGA) packages with a terminal pitch of…
Overview IEC 60191-6-4:2003 - part of the IEC 60191 series - specifies measuring methods for package dimensions of ball grid array (BGA) surface-mounted semiconductor device packages. It defines how…
IEC 60191-6-21:2010 Overview IEC 60191-6-21:2010 is an international standard issued by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor…
Overview IEC 60191-6-19:2010 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the mechanical standardization of semiconductor devices. Spe…
Overview IEC 60191-6-22:2012, titled Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device pac…
Overview IEC 60191-6-12:2011 is an international standard established by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor devices. Specif…
Overview IEC 60191-6-20:2010 is an international standard that provides mechanical standardization rules for semiconductor devices, specifically focusing on the measurement methods for package dimens…
Overview - IEC 60191-6-8:2001 (G‑QFP outline design guide) IEC 60191-6-8:2001 is an International Electrotechnical Commission design guide that standardizes outline drawings and dimensional rules for…
Overview IEC 60191-6-5:2001 is an International Electrotechnical Commission (IEC) standard focusing on the mechanical standardization of semiconductor devices. Specifically, this part of IEC 60191 ad…
Overview IEC 60191-6-10:2003 - "Mechanical standardization of semiconductor devices - Part 6-10" defines the general rules, common outline drawings and dimensional requirements for P‑VSON (plastic ve…
Overview IEC 60191-6-2:2001 - Mechanical standardization of semiconductor devices, Part 6-2 - is an international design guide for preparing outline drawings of surface-mounted semiconductor device p…
Overview IEC 60191-6-3:2000 - "Mechanical standardization of semiconductor devices - Part 6-3" - defines standardized measuring methods for package dimensions of quad flat packs (QFP) classified as F…
Overview IEC 60191-6-6:2001 is an IEC design guide for the mechanical standardization of fine-pitch land grid array (FLGA) surface-mounted semiconductor packages. It defines common outline drawings,…
Overview IEC 60191-6-13:2007 is an IEC design guideline for open-top-type sockets used with Fine‑pitch Ball Grid Array (FBGA) and Fine‑pitch Land Grid Array (FLGA) semiconductor packages. It standard…
Overview IEC 60191-6-1:2001 specifies the general rules for the preparation of outline drawings for surface mounted semiconductor device packages with gull-wing lead terminals. Developed by the Inter…