Найдено: 15
Overview IEC 60749-3:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination" defines a standardized non-destructive external visual inspection meth…
Overview IEC 60749-37:2022 - "Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer" - specifies a standardized board-level drop…
Overview IEC 60749-37:2008 is an international standard published by the International Electrotechnical Commission (IEC) that defines a board level drop test method for surface-mount semiconductor de…
Overview IEC 60749-34:2010 is an essential international standard developed by the International Electrotechnical Commission (IEC) that specifies the power cycling test methods for semiconductor devi…
Overview IEC 60749-30:2020 - "Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non‑hermetic surface mount devices prior to reliability testing" - defines a s…
Overview IEC 60749-34-1:2025 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a power cycling test method for power semiconductor modules.…
Overview IEC 60749-33:2004 defines the unbiased autoclave method for accelerated moisture-resistance testing of non-hermetic semiconductor packages. The test uses a condensing, high-humidity, elevate…
Overview IEC 60749-31:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the flammability of plastic-encapsu…
Overview IEC 60749-39:2021 - "Semiconductor devices - Mechanical and climatic test methods - Part 39" defines standardized laboratory procedures for measuring moisture diffusivity and water solubilit…
Overview IEC 60749-38:2008 is an international standard developed by the International Electrotechnical Commission (IEC) that details test methods for evaluating the susceptibility of semiconductor m…
Overview IEC 60749-39:2006 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses mechanical and c…
Overview IEC 60749-35:2006 is an international standard developed by the International Electrotechnical Commission (IEC), focusing on the procedures for performing acoustic microscopy on plastic enca…
1 Scope This part of IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the po…
What is BS EN IEC 60749 ‑ 30 about? BS EN IEC 60749 ‑ 30 is the 30th part of the multimerise Internation standard on semiconductor devices. BS EN IEC 60749 ‑ 30 establishes a standard procedure for d…