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Overview IEC 61189-5-4:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies general test methods for solder alloys and fluxed and non-flux…
Overview IEC TR 61189-5-506:2019 is a Technical Report from the IEC that documents an intercomparison study to support the development of IEC 61189-5-501. The report validates the introduction of a f…
Overview IEC 61189-5-601:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods related to reflow soldering ability and heat re…
Overview IEC 61189-5-2:2015 is a key international standard developed by the International Electrotechnical Commission (IEC) that outlines general test methods for soldering flux used in printed boar…
Overview IEC 61189-5-502:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for materials and assemblies, focusing…
Overview IEC 61189-5-503:2017 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 defines a general test method for Conductive Anod…
Overview IEC 61189-5-3:2015 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for soldering paste used in printed board…
Overview IEC 61189-5-504:2020 is an international standard published by the International Electrotechnical Commission (IEC). This standard defines a general test method, known as Process Ionic Contam…
Overview IEC 61189-5-1:2016 is an essential international standard published by the International Electrotechnical Commission (IEC) that provides comprehensive test methods for electrical materials,…
Overview IEC 61189-5-501:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that establishes general test methods for assessing the surface insulation…
Overview IEC 61189-5-301:2021 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies general test methods for soldering paste using fine solder p…
What is BS EN IEC 61189 ‑ 5 ‑ 301 about? BS EN IEC 61189 ‑ 5 ‑ 301 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder…
What is BS EN IEC 61189 ‑ 5 ‑ 502 about? BS EN IEC 61189 ‑ 5 ‑ 502 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coup…
What is BS EN IEC 61189 ‑ 5 ‑ 504 about? BS EN IEC 61189 covers test methods for electrical materials, printed board and other interconnection structures and assemblies. BS EN IEC 61189 ‑ 5 ‑ 504 is…
What is BS EN IEC 61189 ‑ 5 ‑ 501 about? BS EN IEC 61189 ‑ 5 ‑ 501 is used to quantify the deleterious effects of flux residues on the surface insulation resistance (SIR) in the presence of moisture.…
What is BS EN IEC 61189-5-503- CAF testing of circuit board about? BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. T…
What is BS EN IEC 61189 ‑ 5 ‑ 601 about? BS EN IEC 61189 ‑ 5 ‑ 601 is a part of the BS EN IEC 61189 multi-series that focuses on test methods for PCBs. BS EN IEC 61189 ‑ 5 ‑ <span data-contrast="auto…