Найдено: 21
Overview IEC 62047-4:2026 is an international standard developed by the International Electrotechnical Commission (IEC) that provides generic specifications for micro-electromechanical systems (MEMS)…
Overview IEC 62047-41:2021 is an International Standard developed by the International Electrotechnical Commission (IEC), focusing on the terminology, essential ratings and characteristics, and measu…
Overview IEC 62047-44:2024 - "Semiconductor devices – Micro‑electromechanical devices – Part 44" specifies terminology, sample requirements and test methods for dynamic performances of MEMS resonant…
Overview IEC 62047-43:2024 specifies a standardized test method for electrical characteristics after cyclic bending deformation of flexible micro‑electromechanical devices (flexible MEMS). The scope…
Overview IEC 62047-4:2008, titled "Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS," is an international standard published by the International Elect…
Overview IEC 62047-40:2021 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on micro-electromechanical (MEMS) inertial shock switches. Specifical…
Overview IEC 62047-47:2024 specifies an in‑situ measurement method for bending strength of microstructures fabricated by micromachining technology in silicon‑based MEMS. The standard defines requirem…
Overview IEC 62047-46:2025 defines an in‑situ tensile strength measurement method for silicon-based MEMS membranes with nanoscale thickness. The standard covers membranes fabricated by micromachining…
Overview IEC 62047-48:2024 defines a standardized test method for determining solution concentration by optical absorption using a MEMS fluidic device. Part 48 of the IEC 62047 series specifies how t…
Overview IEC 62047-45:2025 defines an in‑situ, on‑chip measurement method for the impact resistance of nanostructures fabricated by silicon‑based micromachining for MEMS (micro‑electromechanical syst…
Overview - IEC 62047-42:2022 (piezoelectric MEMS cantilever) IEC 62047-42:2022 specifies standardized measurement methods for the electro‑mechanical conversion characteristics of piezoelectric thin f…
Overview IEC 62047-49:2025 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on the reliability testing of piezoelectric micro-electromechanical s…
1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the bending strength of microstructures which are fabricated by micromachining technology used in silicon-based…
1 Scope This part of IEC 62047 specifies reliability test methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of micro s…
1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the impact resistance of nanostructures which are fabricated by micromachining technology used in silicon-based…
1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the tensile strength of membrane with nanoscale thickness (length from 100 μm to 5 000 μm, width from 100 μm to…