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Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Overhead lines - Testing of foundations for structures
Arc welding equipment - Part 1: Welding power sources
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Low-voltage electrical installations - Part 5-53: Selection and erection of electrical equipment - Devices for protection for safety, isolation, switching, control and monitoring
Nuclear power plants - Instrumentation and control important to safety - Selection and use of industrial digital devices of limited functionality
Fibre optic active components and devices - Reliability standards - Part 4: Guideline for optical connector end-face cleaning methods for receptacle style optical transceivers
Household and similar electrical appliances - Safety - Part 2-95: Particular requirements for drives for vertically moving garage doors for residential use
Railway applications - Electric equipment for rolling stock - Part 1: General service conditions and general rules
Electricity metering equipment - General requirements, tests and test conditions - Part 31: Product safety requirements and tests
Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
Industrial networks - Profiles - Part 1-0: Fieldbus profiles - General concepts and terminology
3D Display devices - Part 12-1: Measuring methods for stereoscopic displays using glasses - Optical
Industrial communication networks - Network and system security - Part 3-3: System security requirements and security levels
Electrical insulation systems (EIS) - Thermal evaluation of combined liquid and solid components - Part 2: Simplified test
Low-voltage switchgear and controlgear - Part 2: Circuit-breakers
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy
Cable networks for television signals, sound signals and interactive services - Part 101-1: RF cabling for two-way home networks with all-digital channels load
High-voltage switchgear and controlgear - Part 316: Direct current by-pass switches and paralleling switches