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Overview IEC 60749-23:2025 - Semiconductor devices: High temperature operating life (HTOL) specifies an accelerated life test to determine the effects of bias conditions and elevated temperature on s…
Overview IEC 60749-25:2003 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices.…
Overview IEC 60749-21:2011 is an international standard published by the International Electrotechnical Commission (IEC) that defines methods for testing the solderability of semiconductor device pac…
Overview IEC 60749-20-1:2019 is an IEC standard that defines standardized handling, packing, labelling and shipping procedures for surface-mount devices (SMDs) that are sensitive to the combined effe…
Overview IEC 60749-24:2004 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor devices.…
Overview IEC 60749-28:2022 is the international standard for device-level Charged Device Model (CDM) electrostatic discharge (ESD) sensitivity testing of semiconductor devices. It defines the field‑i…
Overview IEC 60749-22-1:2025 is a critical international standard from the International Electrotechnical Commission (IEC) detailing mechanical and climatic test methods for semiconductor devices, sp…
Overview IEC 60749-28:2017 - "Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level" de…
Overview - IEC 60749-22-2:2025 (Wire Bond Shear Test Methods) IEC 60749-22-2:2025 specifies standardized wire bond shear test methods to determine the strength of a ball bond to a die or package bond…
Overview IEC 60749-20:2008 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses the mechanical a…
Overview - IEC 60749-20:2020 (Resistance of plastic encapsulated SMDs to moisture and soldering heat) IEC 60749-20:2020 is the International Electrotechnical Commission standard that defines a destru…
Overview IEC 60749-29:2011 is an international standard published by the International Electrotechnical Commission (IEC) that defines mechanical and climatic test methods specifically focused on the…
Overview IEC 60749-24:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST" specifies an unbiased Highly Accelerated Stress…
Overview IEC 60749-20-1:2009 sets the international requirements for handling, packing, labeling, and shipping of non-hermetic surface-mount devices (SMDs) sensitive to both moisture and soldering he…
Overview IEC 60749-26:2025 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) - defines a standardize…
Overview IEC 60749-21:2025 - Semiconductor devices: Mechanical and climatic test methods - Part 21: Solderability defines a standardized procedure for verifying the solderability of device package te…
Overview IEC 60749-2:2002 is an international standard published by the International Electrotechnical Commission (IEC) that defines the mechanical and climatic test methods focused on low air pressu…
Overview IEC 60749-22:2002 is an international standard established by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods for semiconductor device…
Overview IEC 60749-26:2018 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating the electrostatic discharge (ESD) s…
What is BS EN IEC 60749 ‑ 20 about? BS EN IEC 60749 ‑ 20 is the 20th part of semiconductor the multi-series European standard on semiconductor devices. BS EN IEC 60749 ‑ 20 provides a means of assess…
1 Scope This part of IEC 60749 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devi…
1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be…