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Overview IEC 62047-34:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure‑sensitive device on wafer" - specifies test conditions a…
Overview IEC 62047-3:2006 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for a standard test piece used in tensile testing o…
Overview IEC 62047-38:2021 specifies a standardized test method for measuring the adhesion strength of metal powder paste in MEMS interconnection. It applies to metal powder pastes such as anisotropi…
Overview IEC 62047-37:2020 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on environmental test methods for MEMS piezoelectric thin films used…
Overview IEC 62047-32:2019 is an international standard published by the International Electrotechnical Commission (IEC) that defines the test method for nonlinear vibration of MEMS resonators. This…
Overview IEC 62047-36:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films" - defines stand…
Overview IEC 62047-33:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 33: MEMS piezoresistive pressure‑sensitive device" - specifies terms, essential ratings and characteristic…
Overview IEC 62047-31:2019 specifies a standardized four-point bending test method to measure the interfacial adhesion energy (critical energy release rate) of the weakest interface in layered MEMS m…
Overview IEC 62047-30:2017 specifies standardized measurement methods and a reporting schema for the electro‑mechanical conversion characteristics of MEMS piezoelectric thin film. The standard applie…
Overview IEC 62047-35:2019 defines the standardized test method for evaluating the electrical characteristics of flexible micro-electromechanical devices (MEMS) under bending deformation. Developed b…
1 Scope This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mech…
What is BS IEC 62047 ‑ 36 - Test methods for MEMS piezoelectric thin films about? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devic…
What is BS IEC 62047-33 - MEMS piezoresistive pressure-sensitive device about ? BS IEC 62047-33 is the 33rd part of an international standard used for Semiconductor devices-microelectromechanical dev…
What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part of an international standard used for semiconductor devices that specifies the…
What is BS IEC 62047 ‑ 35 - MEMS bending deformation testing about? In the recent trend toward ubiquitous sensor society and the world of internet of things, demand for softer electronic devices is q…
What is BS IEC 62047 ‑ 32 - MEMS resonator testing about? MEMS resonators are small electromechanical structures that vibrate at high frequencies. They are used for timing references, signal filterin…
What is BS IEC 62047-34- MEMS piezoresistive pressure-sensitive devices about? BS IEC 62047-34 is the thirty-fourth part of the Semiconductor devices and microelectromechanical devices that specifies…
What is BS IEC 62047 ‑ 30 - MEMS piezoelectric thin film about ? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim…